Manufacturing Overview
SMT Process :
• 12 Fuji line, 5 Sanyo line, 1 Siemens line
• Automated Optical Inspection (AOI)
• XRF Machine
• X-Ray
• BGA Rework
• ROHS & non-ROHS Compliance
• Nitrogen capability

Plated Through Hole (PTH)
:
• Axial Inserters
• Radial Inserters
• Wave Solder (ROHS & non-ROHS)

Backend Capabilities
:
• Ultrasonic Welding Process
• Manual Soldering upto IPC Class 3
• Standard High Melting Point (HMP) & Gold Soldering
• PCB Router
• Spot Welding
• Mechanical Test

Test Capabilities :
Test Development and Maintenance of
• Radio Frequency
• Audio
• Switching Power Supply (DC/DC, AC/DC)
• Charger
• Digital & Analog Controller
• Flying Probe
Software supported by
• Linux
• Oracle
• Windows
• Visual Basic
• VB.net
• Lab view
• HP Vee

QA & Inspection Equipment :
• XRF
• X-Ray
• OMIS
• AOI
• Thermal Cycle Chamber
• Thermal Shock Chamber

Supporting Team
:
• Supply Chain Management
• New Product Introduction
• Program Management
• Planning
• Production
• Engineering
• Test
• QA
• R&D
• Industrial Engineering

R&D Support Services :
BCM objectives in R&D setup are to support customer on design and development activities.
R&D Capabilities :
Mechanical
• ID Design (Aesthetic Proposal Using Pro-E)
• Mechanical Detail Design (Pro-E)
• Tooling Review, Off Tool Evaluation And Approval
Electronics
• Schematic Design (Power Logic)
• PCB Layout Design (PADs Power PCB)
• CNC PCB Support, Samples Built And Evaluation
• EMC And Safety Pre-Evaluation, Certification With Approval Bod
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